Used SPEEDFAM 24GPAW #9257181 for sale

SPEEDFAM 24GPAW is a precision wafer grinding, lapping, and polishing equipment. It is used to create sub-micron structures on wafers or optoelectronic components by removing surface material, smoothing edges, and creating high quality surfaces. It has a high precision, automated lapping process, with accurate diamond grinding and polishing capabilities. The system is designed for optical, micromachining, and flat wafer processes, and can easily be integrated into existing production flows. SPEEDFAM 24 GPAW utilizes a rotating abrasive disc, with processates applied on its surface. This allows higher levels of productivity than manual processes, and enables the unit to work faster and more accurately on smaller pieces. The machine is designed for both single-wafer deburring and planarization of large flat-surface pieces. Combined with high-velocity spindle loads and rapid rotation speeds, 24GPAW is capable of producing excellent results in shorter cycle times. 24 GPAW also includes an optional optical inspection machine, with automated visual inspections of wafer edges, planarity, and material loss. This enables the machine to quickly detect any defects in the wafer while providing high resolution imaging of the surface. Additionally, the inspection tool features several measurement and analysis functions, such as determining the global flatness of the wafer, its dimensional accuracy, and its surface condition. Finally, SPEEDFAM 24GPAW also has an easy-to-use, user-friendly interface. With intuitive control functions, operators can easily adapt the machine to handle different types of materials and tailor it to the specific application. SPEEDFAM 24 GPAW also features an auto-calibration asset, which ensures consistent results by automatically adjusting the machine's settings depending on the material being processed. Overall, 24GPAW is an ideal wafer grinding, lapping, and polishing model for creating sub-micron structures on optical, micromachining, and flat wafer components. Its high precision, automated lapping process, accurate diamond grinding and polishing capabilities, and easy-to-use user interface allow operators to quickly and accurately create precise surfaces on small or large pieces. Additionally, its optional optical inspection equipment provides detailed imaging of the wafer and detects any defects, making it an invaluable tool for achieving optimal results.