Used SPEEDFAM 24GPAW #9257660 for sale

SPEEDFAM 24GPAW wafer grinding, lapping, and polishing equipment is designed for a wide range of applications in the semiconductor, data storage, medical device, and other industries. It is a multi-functional system for processing large wafers at high efficiency and low cost. The unit features a large process chamber that is fitted with four grinding and polishing heads. Each head contains grinding and polishing media, which can be adjusted to different wafer dimensions and materials, and to achieve various levels of surface roughness. The heads also feature built-in anti-sparking mechanisms and a safety machine that continuously monitors grinding pressure and other parameters, eliminating unsafe working conditions. This chamber also includes a pair of AC-driven adjustable-speed drives, allowing precise movement of the head and ensuring excellent repeatability of results. Adjustable pressure sensors and a level detector in the chamber provide accurate control of the grinding and polishing process. The tool also features automatic loading and unloading of the wafers, thus reducing operator intervention and optimizing production. The cooling asset prevents heat-related damage to the wafers, with a large air-cooled hood over the grinding and polishing chamber. The model also has multiple filtration systems, designed to create a dust-free environment for consistent results. The equipment is fitted with a PLC for operation processing, and features a display with user-friendly graphics for adjustments. The entire system is housed in a stainless steel frame, and is designed to operate in both manual and automated modes. SPEEDFAM 24 GPAW represents a high-performance solution for the grinding and polishing of wafers, allowing for expedited production times and cost savings. It is highly reliable and can be custom-engineered to meet the needs of different industries, thus providing a flexible, cost-effective solution for large-scale production.