Used SPEEDFAM 28B-5L #9143481 for sale

SPEEDFAM 28B-5L wafer grinding, lapping & polishing equipment is a high-performance system for precision surface finishing of semiconductor and other materials. The main components of the unit are the grinding, lapping and polishing table, and the spindle head assembly. All components are designed to provide accurate grinding, lapping and polishing results. The grinding table consists of an adjustable base, a low noise vibration control machine, and a flat plate mounted with a diamond grinding wheel. This diamond grinding wheel is capable of grinding silicon, sapphire, gallium arsenide, and other materials. The grinding wheel is controlled by a user-friendly interface that allows the user to adjust the tool feed rate, rotating speed, and polishing pressure. Additionally, a tilting mechanism is included for increased flexibility when grinding. The lapping and polishing table houses a rotating platen with adjustable speed, and a range of diamond or resin pads for use during lapping and polishing of the substrates. The adjustable pressure feedback tool allows for precise control and repeatable results. The spindle head assembly is the heart of the asset and provides a full range of grinding, lapping and polishing functions. The spindle head is driven by a low power, low-noise, high-efficiency motor which provides precise results without overheating. The chuck is designed to fit standard substrates from 2mm to 9.5mm in thickness. The entire model is housed in a stainless steel enclosure with sound insulation to ensure quiet and efficient operation, and to avoid any contamination from outside. The equipment also features a touch screen panel for easy access to any grinding and lapping settings. 28B-5L wafer grinding, lapping & polishing system is capable of achieving high-precision grinding, lapping and polishing results with fast cycle times, enabling users to obtain precise results without compromising on productivity.