Used SPEEDFAM 28B-5L #9259365 for sale

SPEEDFAM 28B-5L is a superior wafer grinding, lapping, and polishing equipment designed to generate high quality surface finishes and precise thickness tolerances without tedious manual labor. The system is suitable for efficiently preparing a wide variety of semiconductor substrates, such as silicon, gallium arsenide, and quartz wafers. This unit is capable of producing high quality surfaces with very smooth finish, while subsurface damage is minimized. It consists of a motorized single spindle grinding wheel which can achieve surface finishes of less than 1µm Ra and thickness tolerance of up to +1/-2µm. The motor is adjustable, offering a maximum grinding speed of 6000 rpm, while the grinding wheel can rotate at up to 72000 rpm. Its flexibility surpasses many of its competitors. 28B-5L machine also features an integrated lapping and polishing unit which allows users to create low-reflective surfaces with very tight and consistent stock removal rate. The lapping and polishing unit consists of two individually adjustable pressure plates, allowing controlling of lapping/polishing pressure for precise material removal. This production setup is ideal for achieving final thickness tolerances of +6/-8µm and mirror-like surface finishes of less than 0.1µm. In addition, the integrated micro-rough polishing is designed to generate low defect surface finish of up to 0.2µm Ra. A liquid coolant tool ensures optimum coolant temperatures, increasing processing stability and further improving surface finish quality. SPEEDFAM 28B-5L is also equipped with an advanced asset for central debris removal and filtration, significantly increasing tool fitness and lifespan. As a whole, 28B-5L model is designed to offer superior wafer grinding, lapping, and polishing capabilities with high production output, and is the ultimate solution for anyone looking to produce high-quality results in a timely and reliable manner.