Used SPEEDFAM 28B-5L2M #9225432 for sale

SPEEDFAM 28B-5L2M is a state-of-the-art, high precision wafer grinding, lapping and polishing systems, designed for fine-finish production of silicon wafers and flat substrates. This cutting edge equipment utilizes advanced MEMS processes and provides the highest yields and consistent results with the lowest defects. The system boasts many impressive capabilities, starting with the process control of incoming wafer characteristics. A real-time wafer monitoring unit ensures that each wafer is properly evaluated before and during each stage of the process. A robotic wafer handling machine also guarantees exact alignment of wafers to prevent non-uniform grinding, lapping and polishing. A single integrated CNC tool manages all process functions, offering flexibility and repeatability. The asset can handle both serial and parallel processing, allowing for a higher number of products to be completed at one time. The grinding section features a spindle with seven axes of free movement, allowing for a high clarity of wafer edges. The built-in air vacuum helps to reduce process time by removing spent abrasive particles from the surface. The lapping section is highly efficient, with a speed-control feature that allows for rotational speeds up to 450rpm. The powerful motor is powered by a frequency converter and provides repeatable, precise results. The polishing section is fully automated, allowing for both molding and polishing processes. The two polishing platens are capable of running independently, ensuring that all areas of the wafer are evenly polished. The model also has the added benefit of providing a post-polishing quality check. On the whole, 28B-5L2M is a reliable, precise solution for wafer grinding, lapping and polishing processes. Its robust construction and advanced technology make it an ideal choice for the manufacture of high-performance silicon wafers.