Used SPEEDFAM 28B #293657999 for sale

SPEEDFAM 28B is a combined wafer grinding, lapping and polishing equipment that is designed to increase production throughput time for various wafer fabrication processes. The system is a generic solution that is used in wafer fabrication for a variety of industries including semiconductor, optoelectronic, display, and thin film solar. The unit offers very precise, high-performance grinding, lapping and polishing capabilities, making it a go-to choice for a variety of applications. The machine consists of a basic module plus interchangeable grinding, lapping and polishing tools, enabling the user to generate different profiles and finish characteristics on the wafer being processed in a single operation. The precision and repeatability of 28B's operation can be attributed to its large contact-wheel drive and air bearing spindles. The contact-wheel drive boasts a total diameter of 600 mm, while the air bearing spindles are capable of possessing very low friction and providing high-precision during grinding, lapping and polishing operations. The machine also has a very high power-to-weight ratio, making it suitable for use in production environments with limited workspace. Additionally, the user can suspend operations at any time, either manually or via an automated tool, allowing for breaks in production. This additional flexibility can increase the total output and reduce production costs. To provide accurate results with minimal effort, SPEEDFAM 28B also comes equipped with laser sensors for monitoring process parameters. This ensures the exact repetition of desired processing steps for high-precision results. All in all, 28B is the perfect choice for producing wafers with various grade and finish characteristics quickly and efficiently.