Used SPEEDFAM 29 DPAW #9371996 for sale

SPEEDFAM 29 DPAW is an advanced wafer grinding, lapping & polishing equipment designed to meet the needs of the semiconductor industry. This powerful system is capable of processing both framed and unframed wafers, as well as a variety of thin films, layer structures and other substrates used in modern semiconductor fabrication processes. 29 DPAW unit is equipped with advanced grinding, lapping and polishing technology to achieve complex orthogonal geometries, knife edge and inclined planes, as well as optically flat surfaces. It performs planarization and preshaping, all with a very high degree of precision and surface quality. The high precision grinding, lapping and polishing is controlled by a sophisticated computerized machine, providing repeatable and measurable results. The advanced cutting head technology of SPEEDFAM 29 DPAW uses a patented grinding and lapping tool that is composed of diamond abrasives pre-coated on two 4-pad high-speed wheels. This allows faster material removal and improved edge quality, with a very high degree of precision. This asset also features an adjustable air bearing spindle that enables precise workpiece orientation and control while enabling minimal operating vibration for a high degree of accuracy. 29 DPAW also features a unique and efficient polishing model that uses a slurry of abrasive particles in water to create a high-quality finish. This allows for superior surface stability as well as a wide variety of polishing options. The equipment also comes with a range of different polishing pads to help achieve highly specific surface finish requirements. Additional features of SPEEDFAM 29 DPAW include a high-resolution CCD optical surface inspection system, a vacuum unit, and a variety of accessories and spare parts to meet the needs of the ever-evolving semiconductor industry. This machine is capable of handling a wide variety of materials as well as large production volumes, making it an ideal choice for semiconductor processing plants. 29 DPAW is an advanced and reliable tool designed to meet the needs of the semiconductor industry, providing superior grinding, lapping and polishing performance. With its precise cutting head technology, slurry polishing asset, and advanced CCD optical surface inspection model, this equipment is capable of providing excellent results and high-quality output.