Used SPEEDFAM 29DPAW-TD-T0245 #9303743 for sale

SPEEDFAM 29DPAW-TD-T0245 is a wafer grinding, lapping, and polishing equipment designed for the most demanding precision requirements. The one-piece, stainless steel frame is designed to reduce noise and provide superior stability, while the advanced control system makes operation quick and easy. The wafer grinding process is used to thin wafers or prepare thin wafers for further processing. 29DPAW-TD-T0245 has a state-of-the-art grinding wheel unit capable of handling substrates of any size, from small to large. The machine also includes a fully automated wheel cleaning tool for wheel replacement and dressing, as well as a wafer centering device for better and faster processing. The ultra-precision hybrid-drive lapping asset offers precision, repeatability, and accuracy through the application of a vacuum and platen model for vibration-free, air-bearing-supported lapping. The integrated lapping and polishing equipment ensures high quality results through the use of adjustable speed and feed rates, an automated speed and pressure control, and a stepper motor-controlled XYZ stage. The two-component polishing system is designed to offer a versatile and user-friendly solution for materials lapping and polishing. The unit features a high-precision polishing platen, a high-speed rotary polishing wheel, and an automated dust collection machine to ensure a safe and efficient process. SPEEDFAM 29DPAW-TD-T0245 is the ideal choice for component production, device fabrication, and R&D, meeting the most stringent requirements for precision, speed, and accuracy. Its superior construction and advanced control provide a highly efficient and consistent grinding, lapping, and polishing tool. 29DPAW-TD-T0245 is the perfect asset for polishing and grinding of thin wafers and is designed to be reliable and easy to use.