Used SPEEDFAM 30B-5P-2M-N #9410061 for sale

SPEEDFAM 30B-5P-2M-N is a highly accurate and reliable turn-key wafer grinding, lapping and polishing equipment for the production of flat and parallel surfaces on a variety of semiconductor materials. The system features a 5-axis travel configuration with a built-in PoliPol extractor and integrated scrubbing/evaluating station. The unit includes a rotary table with a single 180 degree indexing stop, providing position stability and enabling the operator to quickly tool change. The three process chambers - two grinding and one polishing - are equipped with two load locks with each load lock featuring 150 kg capacity and a unique size evaluation station. The grinding chamber includes two 75-in. 3-jaw chucks and two 3 I.D. grinding spindles capable of unidirectional current speeds up to 8500 rpm. The spindles are mounted on a cantilevered motorized end-effector that moves across the top surface of the wafer throughout the grinding process. The spindles each feature a brushless motor for a mechanism that reduces vibration, as well as stepless speed control for variable spindle speeds. The polishing chamber contains a vacuum chuck for the polishing of portions of the wafer backside. The spindle is a brushless, torque motor with a turret cast to reduce the transfer of heat from sample to motor. The turret is adjustable from the bottom allowing for the operator to fine adjust the speed. 30B-5P-2M-N is an advanced grinding and polishing machine that is user friendly, with a color touch screen, offering a graphical setup, display and data analysis of the grinding and polishing process. This tool also includes a parameter information save/retrieval function as well as an auto-start/auto-stop operation. With its various speeds, sizes, and configurations, SPEEDFAM 30B-5P-2M-N is the perfect asset for a wide range of industrial and research purposes.