Used SPEEDFAM 32 B #9204028 for sale

SPEEDFAM 32 B is a high-performance wafer grinding, lapping, and polishing equipment designed for applications requiring high precision and repeatability. The system is capable of working with wafers up to 8 inches in diameter and up to 0.125 mm in thickness, making it suitable for precision machining of semiconductor wafers, Flip Chips, and Quartz Crystal Wafers. SPEEDFAM 32B unit is comprised of a single-axis motor which is connected to a precision grinding wheel. The grinding wheel is made of super-abrasive materials such as Cubic Boron Nitride (CBN) or Diamond, which provides the necessary cutting action to accurately grind, lap, and polish the wafer's surface. The cutting power is delivered to the wafer's surface by the motor and the grinding wheel. The cutting power is adjustable and the machine can operate at speeds of up to 10,000 rpm. The tool is also equipped with a central mandrel chuck, which acts as the mounting surface for the optional Vacuum Chuck Plate. The Vacuum Chuck Plate is used to hold the wafer securely during the machining process, allowing a tight surface finish. In addition, the grinding wheel can be centered precisely on the wafer's surface with the use of the central mandrel chuck. The grinding wheel is then equipped with a pressurized oil-mist asset which helps reduce abrasion, temperature rise, and thermal deformation of the wafer. This model also helps to evenly distribute the cutting force across the wafer's surface, ensuring the precision and repeatability of the machining results. 32 B is also equipped with a grinding wheel rotation direction control switch, which allows the user to fine tune the grinding wheel's rotation direction to improve the grinding performance. The grinding wheel can be set to rotate in either clockwise or counter-clockwise directions, providing the user with additional flexibility when it comes to machining. The machine can also process external wafers, using an optional spindle attachment. This allows the user to process wafers that are not compatible with the central mandrel chuck. Finally, dust collection is integrated into the equipment's design. This helps to keep the operating environment clean, and also aids in preventing unwanted debris from entering the grinding wheel. The system also features an integrated coolant unit, which helps to reduce wheel wear.