Used SPEEDFAM 32 BAW #9073251 for sale

SPEEDFAM 32 BAW (32 inchâ€'Bond/Abrasive Wheel) equipment is a versatile wafer grinding, lapping and polishing system designed to handle a range of challenging wafer processing applications. It is capable of quickly and efficiently producing wafers and other microelectronic components with high precision and quality. The unit is typically used when an ultra-precise surface finish is required to produce today's demanding specifications. It utilizes a broad variety of abrasive materials, special grinding wheels, and complex in-feed and out-feed technologies to process both thin and thick wafers into finished devices. The main components of 32 BAW include the grinding head, a programmable controller, an embedded computer, a robotic material handling machine, and a vacuum chucked chuck. The grinding head, which acts as the core of the machine is composed of two spindles that drive two diamond grinding wheels. The spindles and the wheels are capable of rotating at high speeds, allowing them to achieve high precision and accuracy in wafer grinding. A programmable controller enables the operator to program and monitor the grinding process, as well as to adjust the levels of precision and quality of the finished product. The embedded computer allows the operator to program and manage grinding operations from a central location. The robot material handling tool helps to securely transport wafers from one workstation to the next. Lastly, a vacuum chucked chuck allows the operator to securely grab and hold the workpiece during the grinding, lapping and polishing processes. The asset is designed to be reliable and robust and is capable of handling a variety of wafer processing applications. Its innovative technologies and robust design make it a powerful and cost-effective solution for achieving high precision and quality in today's highly demanding microelectronic components.