Used SPEEDFAM 32 BTAW #9181278 for sale

SPEEDFAM 32 BTAW is a wafer grinding, lapping and polishing equipment designed for the automotive industry. This system is ideal for lapping and polishing thin, brittle, and fragile wafers made from various materials and varying wafer thicknesses. SPEEDFAM 32BTAW is manufactured by SPEEDFAM, an industry leader in the design and manufacture of advanced wafer processing solutions. The machine utilizes a high precision, three-axis CNC unit for precise cutting and grinding capabilities. It boasts a high-quality air-bearing lathe machine which keeps grinding and lapping operations consistent over time, and produces parts that meet or exceed the company standard quality goals. The tool also includes a precision dual spindle for fast spindle speeds and consistent surface finishes. 32 BTAW utilizes a variety of technologies and high-power motors to provide precise, repeatable wafer cutting and grinding. It comes with a range of process-management tools, allowing operators to monitor and control every aspect of the process from one easy to use interface. The machine is equipped with a cutting envelope that can accommodate a wide range of wafer sizes to allow for more efficient grinding and lapping processes. The asset also has the ability to produce custom wafers and grind to tight tolerance specs. The process is easy and fast, and allows for precise measurements and perfect finishing results. The machine is equipped with a drain chute, dust collector, and odor management model, allowing for cleanroom compliant operations. 32BTAW is built for convenience, speed, and accuracy - and is suitable for all types of production requirements. The equipment is able to grind highly abrasive wafers, as well as process fragile wafers with a uniform and consistently smooth finish. This system is a great choice for the automotive industry, medical, aerospace, and other industries that need durable and high-quality wafer grinding and lapping capabilities.