Used SPEEDFAM 32 BTAW #9181279 for sale

SPEEDFAM 32 BTAW is an advanced wafer grinding, lapping, and polishing equipment designed for semiconductor industry applications such as backside thinning, backside grinding, wafer slicing, and backside polishing. With the latest BTAW technology, the system features improved grinding, lapping, and polishing speed and higher throughput for faster production. SPEEDFAM 32BTAW is built to provide more precise grinding, lapping, and polishing to reduce wafer thinning, allowing for more reliable and advanced semiconductor device manufacture. The unit is configured with up to three grinding, lapping, and polishing spindles, and the machine is outfitted with a powerful processor and high-speed spindle controllers to allow for optimal speed control. 32 BTAW is also equipped with a closed-loop temperature control machine that helps optimize cutting line control and ensures accurate material removal rate. Additionally, the tool features a removable ring asset that works with different shapes of wafer materials. This allows users to easily remove rings from the machine for faster production or for easier transport to other facilities. The operator interface of 32BTAW is designed to streamline the grinding, lapping, and polishing process. It features a digital display for easy access to the model's current information such as parameters, equipment status, and job history. Additionally, the system includes user-selectable programs for faster production and improved performance. SPEEDFAM 32 BTAW is designed to provide reliable performance while requiring minimal operator oversight. The unit includes a Stainless Steel cover to help protect against contamination, and an automatic lubrication machine to ensure the spindles and bearings remain well-maintained for better performance. SPEEDFAM 32BTAW is designed to be a cost-effective and versatile wafer grinding, lapping, and polishing tool for a variety of semiconductor applications. With its latest BTAW technology, the asset offers improved speed and throughput for faster production and improved wafer thinning. The model features a user-friendly interface, along with advanced temperature and cutting line control, ensuring reliable and precise performance.