Used SPEEDFAM 32 BTAW #9354406 for sale

SPEEDFAM 32 BTAW is a wafer grinding, lapping & polishing equipment designed to increase the throughput and generate quality surfaces on wafer substrates in the semiconductor industry. It is designed to meet the needs of frequency applications, such as producing uniform surfaces with advanced beam size control. The system is composed of several units designed to machine a single wafer at a time. Beginning with the grinding stage, the unit features a multiple-wheel grinding head that uses two precision-driven grinding wheels to provide fast and accurate grinding of the wafer. The grinding head is adjustable and can accommodate various grinding wheel diameters from 150 mm to 300 mm. This stage also utilizes CCD camera monitoring to help ensure the high accuracy and repeatability of the grinding process. After grinding is complete, the wafer is sent to the lapping stage where it is smoothened via an abrasive particle slurry fed by a control pipette. The lapping station features an enclosed grinding chamber to control the environment and a powerful lapping motor to provide the highest profile control. An automated slurry replenishment machine ensures that precise amounts of abrasive particles are delivered with each tape cycle. The last stage of the machine is its polishing stage, which is equipped with a modern polishing head capable of providing highly uniform surface finishes in the shortest possible time. This head uses a combination of rotating and vibrational motion to achieve planarization of the wafer surface. It is equipped with multiple polishing pads that are each loaded with different chemical components in order to produce highly homogeneous polishing. Additionally, the polishing station can also be outfitted with CCD cameras to monitor the results. SPEEDFAM 32 is designed to maximize product yield while reducing maintenance requirements. The advanced control tool provides the flexibility to adjust parameters throughout the entire grinding, lapping and polishing process. In addition, it is designed to reduce energy requirements and costs. It can also be outfitted with a range of blade configurations that can be adjusted according to the customer's needs. With its superior design and versatility, SPEEDFAM 32BTAW wafer grinding, lapping & polishing asset is an ideal solution for semiconductor process needs.