Used SPEEDFAM 32 BTAW #9366202 for sale

SPEEDFAM 32 BTAW is a state-of-the-art wafer grinding, lapping and polishing equipment from SPEEDFAM. With a 32-inch wafer capacity, the machine offers simultaneous grinding and polishing at the highest levels of accuracy and repeatability. The system offers both manual and automated single- and dual-side operations for high performance lapping and polishing of wafers. SPEEDFAM 32BTAW is a three-axis unit offering maximum versatility to meet production requirements. With two independent wheel-heads, the machine can process multiple projects simultaneously. The machine also adds flexibility with a high-precision adjustable table and lapping plates, providing high accuracy positioning and positioning repeatability. It also offers a choice between manual and automatic aspect control, as well as in-process measurement and control of the surface. The tool features a range of process variables such as temperature control, power management, grinding/polishing pressure and slurry management. Additionally, it offers a range of segmented lapping plates, which, when combined with the high sampling rate capability and real-time data acquisition, allows easy process variable control. 32 BTAW is also equipped with a special end-of-cycle safety device, which prevents accidental switching of polishing plates, as well as an automatic safety interlock asset that ensures proper start-up processing conditions. The model also allows for easy access with quick and easy setup changes due to its use of the interchangeable plate concept. This eliminates the need to adapt to different wafer specifications. The interchangeable plate concept also allows for reduced wheel consumption, metrology and other costs. To ensure quality and performance levels, 32BTAW grinder/polisher equipment is supplied with a calibration plate to measure and adjust the relative positions of the grinding wheels and lapping plates. Additionally, the system is also fully compatible with all types of cooling and air bearing systems. SPEEDFAM 32 BTAW wafer grinding, lapping and polishing unit provides the highest levels of accuracy, repeatability and flexibility, allowing customers to achieve improved process control and better wafer yields, for more cost-effective processes and more efficient production.