Used SPEEDFAM 32 BTGW #9147223 for sale

SPEEDFAM 32BTGW is a multi-function wafer grinding, lapping and polishing equipment. Designed by SPEEDFAM, a Japan-based manufacturer of specialized machining systems, this high-precision system is capable of polishing flat surfaces and planar surfaces on wafers up to 32 inches in diameter, with a surface finishing accuracy of 2-3 microns. It is one of the most versatile systems on the market for wafer grinding and polishing applications; mechanically and technologically, its components and peripherals are optimized for non-stop production. The unit consists of a board, a base machine, a polishing machine, and other components. The board is constructed from stainless steel and aluminum alloy, giving it durability and stability and has a working surface of 64 inches in size. The base machine works by passing wafers between resilient or rigid grinding wheels to grind or polish wafers to a specified thickness or shape. The polishing machine uses a polishing pad and slurry to attain high surface finishes on both flat and contoured surfaces. 32BTGW optimizes efficiency with a servo-driven carriage and a fast traverse speed of 300 millimeters per second. The machine also reduces vibration and noise while increasing cutting velocity with its advanced triple-axis CNC control technology. In addition, it incorporates an automatic-grinding head changing tool and dual-axle grinding heads to enable high speeds while maintaining flat grinding. Also included is an integrated grinder film tester which can monitor the condition of the grinding wheel and remove uneven wear or residual material quickly. SPEEDFAM 32BTGW asset has been engineered to work with a wide variety of grinding wheel electrodes and slurry solutions, allowing it to handle a wide varriety of wafer machining tasks. The model supports rough grinding, fine grinding and ultra-smooth grinding programs which optimize grinding capabilities and speed. Furthermore, the abrasives are designed to last long while reducing wafer distortion. By featuring the latest Generation 9 software, 32BTGW provides an intuitive user interface which supports dynamic data capture and processing, as well as graphical tracking and guiding. This reduces wafer production time and offers an easier workflow for the user. The equipment also features improved control for consistent uniformity and repeatability of results. SPEEDFAM 32BTGW is the perfect choice for high-precision, high-volume grinding applications. Offering higher precision results, and robust construction, the system is ideal for any number of high-volume tasks.