Used SPEEDFAM 32 DTAW #9143444 for sale

SPEEDFAM 32 DTAW is a bench-top wafer grinding, lapping and polishing equipment. This system combines the performance of both the wet grinder and the dry lapping and polishing into one single machine to create a single, integrated piece of equipment. It is designed for maximum precision and accuracy in a variety of applications, including semiconductor, OLED and related substrates. The device has a 32.75" (832 mm) maximum wafer diameter capacity, delivering excellent wafer surface finish accuracy in both wet and dry lapping and polishing processes. 32 DTAW offers a host of advanced features that help provide an outstanding productivity output. These features include a four-axis motion unit for optimum workpiece orientation control for grinding, lapping, and polishing. The machine also offers a digitally-controlled adjustment of a variety of process parameters, such as running speeds, pressure, and grit settings, as well as variable liquid flow through the process. This ensures that the user has full control of the workpiece orientation, as well as maximum efficiency and accuracy in the process. SPEEDFAM 32 DTAW also features various safety and efficiency features to ensure that operators have the utmost levels of safety and convenience. It comes with an emergency stop button and an audible alarm. This machine design also incorporates ergonomically designed handles and levers on the grinding, lapping, and polishing surfaces to provide maximum operator comfort. 32 DTAW also comes with an intuitive graphical user interface. This user-friendly control panel allows users to easily tweak the necessary parameters that adjust the speed and pressure for grinding, lapping, and polishing processes, as well as to monitor all the important process parameters in real time. SPEEDFAM 32 DTAW is powered by a high-performance motor with a frequency of 60 Hz that provides the necessary power to facilitate accurate grinding, lapping, and polishing jobs. This powerful motor also ensures that the machine is capable of delivering high-yield grinding, lapping, and polishing results even at high processing speeds. This allows the tool to deliver excellent quality and precision results. In summary, 32 DTAW is a powerful and efficient bench-top wafer grinding, lapping and polishing asset that provides superior production output with precise and accurate accuracy. It features advanced features that help ensure a safe and efficient operation, such as an emergency stop button, an audible alarm, and an intuitive control panel. The device is also powered by a robust motor, making it capable of achieving excellent quality results even at high speeds.