Used SPEEDFAM 32 GPAW #9214080 for sale

SPEEDFAM 32 GPAW is the latest in wafer grinding, lapping and polishing technology. It uses advanced grinding, lapping and polishing principles to achieve superior performance. The machine is designed for the production of high-end, high-performance wafers - reducing production time and costs while delivering superior results. The spindle is powered by a high speed, direct drive brushless motor that ensures efficient and consistent power. This is further coupled with patented air pressure technology which reduces grinding and polishing time significantly. The system is designed to deliver precision and accuracy with low operating costs and reduced cycle times. The machine also features a uniform sized grinding wheel and adjustable polishing head to provide superior results. 32 GPAW is constructed from quality components, making it robust and reliable. It is conveniently compact size yet designed to produce top-tier quality wafers. Additionally, a vacuum system is included to reduce dust and debris during the process. The advanced control system allows precise pressure and speed settings. This delivers precisely repeatable results while making process monitoring easier. Furthermore, the software allows the user to save and recall commonly used processes for further ease and convenience. Overall, SPEEDFAM 32 GPAW is a go-to for those looking for high-end wafer grinding, lapping and polishing solutions. It is easy to integrate into existing systems and the results are top-tier. Through its use of advanced grinding and polishing principles, the machine is able to reduce costs, cycle times and production time.