Used SPEEDFAM 32 SPAW #9073252 for sale

SPEEDFAM 32 SPAW (Single Plate Abrasive Wafer grinding, lapping, and polishing equipment) is a high-precision machine ideal for handling and processing a variety of semiconductor wafers. This system is fully automated for superior abrasive grinding, lapping, and polishing of wafers, making it a valuable asset for any production or research facility. 32 SPAW features a rotary table design with a fixed diamond grinding tool and rubber polishing mandrel mounted above the table. This unit is capable of grinding and polishing up to 32 wafers simultaneously, and is suitable for wafers with a size range from 2" to 4". The machine is also designed to be able to handle wafers with different thicknesses with minimal setup time. The tool is driven by an AC spindle motor, allowing for precision grinding and polishing of the wafers. The diamond grinding tool is adjustable and can move in the X and Y axes, giving the user the flexibility to tailor the grinding process to the individual wafer, as well as giving them the ability to control the grinding specifications. SPEEDFAM 32 SPAW also features a unique modular lapping asset, equipped with automated adjustment of the diamond lapping tool, which enables up to 8 lapping passes per wafer. The diamonds used in this model are of superior quality, and are selected according to the type of lapping and polishing process being conducted. The post-process inspection of semi-conductors requires a high degree of accuracy. This equipment has been designed to meet those requirements, with its on-board edge detection system that can determine the shape and position of the edges of the wafer. It also has a cutting-edge data acquisition unit that records and stores the grinding and polishing parameters, in order to provide a higher degree of accuracy and repeatability. Finally, the optional in-line particle counter ensures that the dust particles generated during the grinding and polishing process can be monitored in real-time, allowing for minimal wafer contamination. This ensures that only wafers that meet the highest degree of cleanliness are produced. 32 SPAW is a versatile and reliable machine for grinding, lapping, or polishing a variety of wafers. Its innovative features ensure that the wafers can be processed to meet any application's requirements, while ensuring high levels of accuracy and repeatability.