Used SPEEDFAM 32 SPAW #9238409 for sale

SPEEDFAM 32 SPAW automatic wafer grinding, lapping and polishing equipment is the ideal solution for high-accuracy and high- throughput applications requiring the highest of precision in the grinding, lapping, and polishing process. Equipped with a unique 32-axis design, this system is capable of reaching sub-micron tolerances while consuming very minimal power. 32 SPAW is equipped with a 130mm X 24 plates wafer carrier that allows for a maximum of 32 wafers to be processed at once. This unit also features a low-profile design, making it a perfect fit for tight working spaces. Its variable speed chopper helps to ensure that the process is smooth and precise no matter the requirements. SPEEDFAM auto centering and auto threading capability further enhances the precision, accuracy, and throughput of this machine. It also increases throughput efficiency by allowing the machine to run without manual intervention. In addition to its notable grinding, lapping and polishing functions, SPEEDFAM 32 SPAW features a fully automated ultra-fast spacer removal tool that prevents scratches, dents, and other damages to the surface of the wafers. This asset also includes an on-board monitoring model, allowing users to quickly evaluate the quality of finished wafers. Furthermore, this equipment is HSE compliant. It is designed to consume minimal power and has an energy-saving mode that further reduces power usage. Additionally, the dust-free operation makes it well suited for a variety of delicate applications. Overall, 32 SPAW is an ideal solution for high-accuracy applications. Its unique 32-axis design and its automated ultra-fast spacer removal system ensure precision and fast results. Its low-power consumption and dust-free operation make it suitable for a variety of applications, while its on-board monitoring unit allows users to quickly evaluate the quality of finished wafers.