Used SPEEDFAM 32 SPAW #9257661 for sale

SPEEDFAM 32 SPAW is a multi-function wafer grinding, lapping and polishing equipment designed for grinding and polishing of wafer substrates from 20mm to 260mm in size. It is an ideal choice for low-cost, fast throughput applications. 32 SPAW consists of a three-phase grinding head and an integrated polishing unit. The grinding head is equipped with a powerful synchronous motor, allowing for a wide range of cutting speeds and high performance grinding and lapping. The integrated polishing unit is powered by two brushless DC motors allowing for either continuous or block-by-block process automation. The complete grinding and polishing process is based on the PHEELS, a sophisticated software-controlled system. SPEEDFAM 32 SPAW features a nine-axis kinematic table, allowing for fast and accurate grinding operations with high repeatability and high wet and dry accuracy. It is able to perform grinding and polishing processes on semiconductor wafer substrates, such as silicon, gallium arsenide, silicon carbide, and aluminium nitride substrates. In addition, the unit is equipped with a special spindle-mounted disk holder that allows for the placement of the wafer on the machine without unnecessary wear and tear, improving the machine's cost-effectiveness. 32 SPAW is designed using high-grade components ensuring reliability in production and longevity in service. It includes multiple safety features such as automatic tooling changing, automatic wheel dressing, and pre-programmed grinding and polishing profiles. SPEEDFAM 32 SPAW is also integrated with a sophisticated control tool, allowing for faster setup due to automatic pathfinding and tool loading, and improved process consistency through a closed-loop control asset. Overall, 32 SPAW is a reliable, strong, and cost-effective model suitable for a wide range of wafer grinding, lapping and polishing applications. It offers high performance, accuracy, flexibility, and repeatability, making it an ideal tool for high-volume manufacturing environments.