Used SPEEDFAM 32 #293797188 for sale

SPEEDFAM 32 is a wafer grinding, lapping and polishing equipment designed to produce precise, high quality flat surface finished on both sides of single or multiple semiconductor or electronics components at high speed. The system features a modular platform that supports two sets of interchangeable grinding, polishing and lapping modules that can grind, lap and polish different types of surfaces with the same grinding tool. It also includes a patented drive head that allows the grinding and polishing machines to do precise grinding, polishing and lapping of wafers at high speeds. 32 unit uses a number of advanced components to achieve a high level of precision in the grinding and lapping of wafers. The three main components include a motor drive machine, a grinding/polishing head attachment and an optical control unit. The motor drive tool is able to provide the precise and repeatable movements required for wafer grinding, lapping and polishing. The grinding/polishing head attachment is designed to perfectly align the grinding and polishing discs with the optical control unit for maximum efficiency. The optical control unit is used to monitor and adjust the speed, position and profile of the grinding/polishing discs during the grinding/polishing process. In addition, SPEEDFAM 32 also incorporates a number of different grinding/polishing discs, polishing/lapping compounds, and fluid deposits as well as a vacuum asset to optimize the wafer grinding and polishing process. These components allow the precision grinding and polishing of extremely smooth or highly textured surfaces. In addition, 32 model also includes an automated error correction technique, which monitors and compensates for the grinding/polishing errors, enabling very precise grinding and polishing of surfaces with each and every iteration. SPEEDFAM 32 equipment offers a number of advantages in the process of grinding, lapping and polishing fines, such as low total cost of ownership, and high precision, repeatability and throughput. By using a combination of automated error correction, precise lapping/polishing discs, polishing/lapping compounds, and atmosphere control fluids, the system can produce high-accuracy surfaces at high speeds. With its robust design and high precision levels, 32 unit can be used for a variety of grinding and polishing applications.