Used SPEEDFAM 32 #9215275 for sale

SPEEDFAM 32 wafer grinding, lapping, and polishing equipment is an automated, high-precision processing system for wafer substrates. It is specially designed for use in the semiconductor industry. The unit uses advanced process control technology to ensure exact, uniform, and repeatable results across multiple processes. 32 boasts a high-performance dual spindle configuration that utilizes an innovative, patented, and exclusive direct drive, belt-less machine. This allows for extremely accurate rotary speed and positional accuracy. With the dual spindle tool, wafers can be processed for the lapping and polishing operations simultaneously. The innovative spindles provide a unique feature called "true speed control", which allows the asset to operate at the optimal speed for each process. This feature offers superior process control and reliability. The model features a high-precision computer-controlled workholder that ensures the most accurate positioning of the wafers during the grinding and lapping stages. The modular design of the equipment allows for multiple process sequences that can be programmed via the intuitive software interface. The system is also equipped with advanced diagnostic tools, which enable fast process troubleshooting. SPEEDFAM 32 is a complete turnkey installation that includes an array of guarding components, covers, and structure to ensure operator safety. The fully-enclosed workzone ensures a safe, dust-free environment for the precision process. The sophisticated safety features also reduce the risk of contamination of the wafers. 32 is a reliable, precise, and efficient wafer grinding, lapping, and polishing unit. With its powerful and innovative direct drive, belt-less spindle configuration, and advanced process control technology, it is an ideal choice for the high-precision processing of wafers for the semiconductor industry.