Used SPEEDFAM 32 #9411971 for sale

SPEEDFAM 32
ID: 9411971
Lapper / Polisher.
SPEEDFAM 32 is a wafer grinding, lapping, and polishing equipment designed for applications requiring precision and accuracy in wafer finishing. This system addresses the needs and requirements of the semiconductor industry for high speed grinding, lapping and polishing. It is equipped with diamond wheels, making it suitable for the manufacture of advanced semiconductor devices. The unit includes a three wheel grinding wheel assembly that is used for contouring and smoothing the surface of semiconductor wafers. 32 inch wheel is used for rough grinds and to remove large burrs before performing subsequent operations. For fine grinding, two grinding wheel assemblies are available with 15 and 20 inch diameters, respectively. The smaller wheels are used for producing precise flat, level and high-resolution ground surfaces. In addition to grinding wheels, SPEEDFAM 32 is equipped with lapping and polishing wheels in order to produce extremely precise surfaces. The lapping and polishing wheels are composed of special abrasive materials, such as diamond and aluminum oxide, and measure from 8 to 24 inches in diameter. Using these wheels, it is possible to achieve high-grade surface planarity, vertical flatness and roughness. The control machine of 32 is designed to provide a user-friendly and intuitive user interface, allowing for easy operation and adjustment of grinding, lapping and polishing parameters. The touch screen control panel enables inputting parameters such as rotation speed, feed rate, coolant flow and pressure, making it easy to obtain a perfectly flat and precise surface. Furthermore, the tool is equipped with over-current protection, which prevents damage and features the ability to store multiple settings. Overall, SPEEDFAM 32 wafer grinding, lapping and polishing asset is an ideal solution for wafer processing requirements, providing optimal accuracy and precision grinding, lapping and polishing. Its three grinding wheels, along with its lapping and polishing wheels and user-friendly control model make this equipment ideal for achieving optimum results in the semiconductor manufacturing process.
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