Used SPEEDFAM 32BAW #9358880 for sale

SPEEDFAM 32BAW is a state-of-the-art wafer grinding, lapping, and polishing equipment designed to provide precise surface integrity and finish. It is composed of a main process unit, a controlling computer, and a library of grinding and polishing tools. The process unit is capable of the precise application of multiple polishing steps with variable parameters to assure superior surface finishes and high-yield performance. The machine is capable of grinding both sides simultaneously on a single process wafer. The base frame of the system is made from high strength steel and is designed for long service life and smooth operation. The grinding, lapping, and polishing segments consist of unique rotational grinding and polishing heads, which can rotate at various speeds up to 6,000 RPM. The unit includes an automatic, programmable, spiraling, and probing option. The lapping head has adjustable load settings and pressure levels for each step of the polishing operation. The unit also includes a built-in vacuum machine for lapping operations. A high-resolution CCD camera provides detailed visual inspection of the wafers before and after the grinding, lapping, and polishing processes. An automatic in-process wafer-size monitor eliminates over/under lapping. The controlling computer is used to store recipes, monitor and control the whole process, and provide all the necessary information to the user. It is also used for programming operation parameters, storing recipes, monitoring production process and collecting production data. The lapping library provides a wide selection of lapping tools from various vendors, suitable for most wafers, sizes, and polishing applications. 32BAW is a powerful and flexible wafer grinding, lapping, and polishing tool, providing superior process control and repeatability for high-yielding, precise wafer processing. Its unique features and robust design make this asset the ideal choice for high-volume production of wafers without compromising quality.