Used SPEEDFAM 32SWM #9358878 for sale

SPEEDFAM 32SWM is a wafer grinding, lapping and polishing equipment that is designed for high-volume production of Microelectromechanical Systems (MEMS) and other small diameter silicon-on-isolator (SOI) wafers, boasting excellent throughput and wafer-to-wafer uniformity. 32SWM is a time-tested, industry leader for high-end lapping and polishing of wafers ranging from 1" to 8" in diameter and up to 600um thickness. The versatile machine is equipped with a panel of 32 as well as lapping and polishing platens, and is designed for efficient and comprehensive substrate processing. SPEEDFAM 32SWM offers a unique twin-head design that can lap surfaces in one direction, allowing for symmetry and high-resolution finish, while also capable of bi-directional lapping for further uniformity. A 3-axis system with rapid attachment and automatic centering ensures the highest precision when lapping the wafer. The lapping unit also includes aero-mechanical apparatus that utilizes a controlled airflow, reducing pad wear and ensuring maximum efficiency with minimal material loss. This feature also decreases the machine's noise level for maximum operating comfort. To ensure a consistent, low noise operation, 32SWM's lapping and polishing control tool processes temperatures, speeds, and loads in real-time. The pressure of the lapping plate is precisely controlled for environmental sustainability and uniformity of the finished product. The software also provides comprehensive traceability and statistics that allow the operator to track the finished process. The asset is designed for maximum flexibility. The main unit can be supplemented with Pressure Bowls and a 6" Vacuum Chuck, allowing for the processing of a variety of wafer sizes and shapes. The integrated Control unit provides for rapid switching between different lapping and grinding processes. To ensure quality throughout the entire production cycle, SPEEDFAM 32SWM model comes packaged with an integrated quality assurance equipment that includes an intelligent metering and control system for every axis; in-process monitoring of the lapping process with real-time measurements; and an end-process assessment unit. 32SWM machine is synonymous with high-volume, reliable lapping and grinding, and offers processing speeds that are five times higher than competitive machines. With its high-resolution finish and superior finish uniformity, the tool is the ideal choice for any production line.