Used SPEEDFAM 36 DAW #9294575 for sale

SPEEDFAM 36 DAW is a powerful, fully automated wafer grinding, lapping and polishing equipment. It is highly advanced for its time, and is designed to achieve fast and precise grinding, lapping and polishing of a range of wafers. It has been optimized to guarantee short cycle times and high surface finishing quality. The system is equipped with a CNC control that allows for programming and executing of complex grinding, lapping and polishing processes. Its user-friendly graphical interface enables the operator to customize a variety of settings, while its advanced software can easily find the optimum grinding, lapping and polishing parameters for each individual wafer. It is capable of grinding two different wafer sizes with a maximum wafer diameter of 200mm. It can handle wafers up to 8mm thick, with a grinding depth of up to 40 mm. This machine is equipped with a spindle motor, grindstone, lapping plate and option of three types of polishing stones, depending on the desired wafer characteristics. The drive mechanism for the motor is done by a brushless servo motor, which allows for high accuracy and repeatability. The integrated cooling unit ensures uniform temperature of the wafer throughout the process, which is necessary for obtaining accurate results. The machine also includes an automated loading/unloading device for the wafers, operated by a robotic arm. It is equipped with a vision sensor for inspecting the wafer surface, and can also be linked with an integrated vision tool with microscope. A range of diagnostic features ensures a measure of operational security. The machine has self troubleshooting and preventive maintenance features, and it is equipped with sophisticated software programs to detect any potential errors. It also provides a way for operators to program complex processes and execute them without any manual intervention. 36 DAW has become a reliable panel for grinding, lapping and polishing processes in the semiconductor industry. Thanks to its robust construction, precise and fast operations, along with an easy to use interface, it can produce high quality and highly uniform wafer surfaces.