Used SPEEDFAM 36 DPAW #293758244 for sale

SPEEDFAM 36 DPAW is a wafer grinding, lapping and polishing equipment designed for producing precision flat surfaces on semiconductor wafers. The system is equipped with a 36 inch diameter diamond polishing platen that is capable of grinding and lapping substrates up to 10 inches in diameter. 36 DPAW employs a wet polishing process that uses polymethylmethacrylate (PMMA) and colloidal silica suspension slurries to obtain flat surfaces with excellent roughness and low total height variation (THV) measurements. The unit consists of a platen that rotates at speeds of up to 180rpm and draws the wafers and/or substrates in and out of the polycrystalline diamond (PCD) chip. A central processing unit (CPU) is also included for controlling the operating parameters. The platen is equipped with a double-action taper (DAT) mechanism which allows the surface of the platen to move outward or inward to maintain constant pressure. The DAT mechanism ensures that the pressure applied to the wafers remains uniform after multiple polishing cycles. The edge condition of the wafer is also monitored during the polishing process to prevent chipping or breakage when polishing is finished. The machine is compatible with all standard wafer sizes, substrates, and compounds. The polishing and lapping process utilizes a unique set of tools and diamond slurries to obtain the desired product. The diamond slurries are specially formulated to provide a consistent and repeatable surface finish, while the abrasive particles present in the slurry enable faster material removal. SPEEDFAM 36 DPAW can be operated in manual or automatic mode, whichever best suits the application. With manual operation, the operator has full control over the speed and pressure of the rotating platen. In automatic mode, the CPU automatically adjusts the pressure and RPM for optimal polishing and lapping processes. The unit is easy to install and maintain. It is equipped with a self-diagnosis tool that allows the user to identify any mechanical or electrical faults that might occur during the operation of the asset. In addition, the model is equipped with an on-board visual inspection equipment which automatically detects and identifies any potential defects in the wafer or substrate. Overall, 36 DPAW offers a cost-effective solution for high quality flat surface polishing and lapping tasks in the semiconductor industry. This system is recognized for its durability, precision and improved efficiency, making it a reliable choice for achieving desired results.