Used SPEEDFAM 36 DPAW #9294573 for sale

SPEEDFAM 36 DPAW is a revolutionary wafer grinding, lapping and polishing equipment designed for production-class precision. Engineered to provide precise surface finish and high throughput, this system is ideal for achieving consistent, high-quality surfaces on a variety of wafer materials. This unit is comprised of several essential components: a soft-start 36-inch grinding/polishing head, a lapping/polishing unit, a lapping/polishing head, a wafer tray/mounting arm, and a recirculating filtration machine. The grind/polish head employs a precisely engineered diamond belt and a sophisticated polishing process to ensure the most precise surface finishes on a variety of wafer materials. It utilizes a direct-drive motor that provides more consistent speeds than traditional AC motors. Additionally, its soft-start feature reduces down-time between operations. The lapping/polishing unit features a two-axis servo tool that precisely controls both the rotation and travel of the base. This allows for reliable, high-accuracy lapping on the edges and corner points of the wafer surface. Its perforated belt is capable of grinding and removing a variety of surface irregularities with ease. Additionally, its lapping/polishing head has a higher acceleration rate than other machines, allowing for faster, more reliable performance. The wafer tray/mounting arm allows for quick mounting and removing of wafers for each process step. Its precise position accuracy makes it easy to fine-tune each operation and keep uneven surfaces at bay. Also, its built-in storage capacity provides protection for a variety of wafer types. Finally, the recirculating filtration asset ensures that your process is constantly protected from dirt and other contamination. The filtration model can be adjusted to meet your specific requirements, allowing for a wide variety of applications. In addition to being incredibly accurate and reliable, 36 DPAW is able to offer faster grinding and polishing times compared to other systems. With its precise surface finishes, higher throughput rates, and comprehensive protection, SPEEDFAM 36 DPAW is a great choice for wafer grinding, lapping, and polishing operations.