Used SPEEDFAM 36 DPAW #9294574 for sale

SPEEDFAM 36 DPAW (double-sided planetary abrasive wheel) is a wafer grinding, lapping, and polishing equipment that provides high quality surface finishes and accuracy for a wide variety of semiconductor applications. This system is designed to provide maximum throughput and minimum process time with minimal operator intervention. 36 DPAW is equipped with a unique planetary grinding/lapping and polishing head featuring three independently driven wheel sets accommodating four different polishing/grinding plates. This feature allows for multi-coordinate and/or multistep lapping and polishing operations. The three independently adjustable wheel sets have a nominal working range of +/−25 μm and are driven through a servo motor unit to ensure high repeatability and accuracy. The machine is further equipped with a high-resolution video tool, allowing for accurate real-time viewing of the grinding/lapping and polishing process. This feature makes it possible to inspect process parameters and to dynamically monitor the workpiece surface for the accurate measurement and optimization of process parameters. In addition, this asset features a State of the Art CNC control model, programmed for unattended operation, making it an ideal wafer processing equipment for production applications. SPEEDFAM 36 DPAW is designed to provide maximum throughput and minimal process time. The programmable spindle speeds allow for high precision grinding/lapping and polishing operations on a wide range of materials. This system is also capable of running in both dry and wet environments, making it suitable for a wide variety of processes. For those requiring a high level of process repeatability and accuracy, 36 DPAW offers a wide range of process parameters that can be set for specific grinding/lapping and polishing operations. This unit suits applications requiring sophisticated procedures such as high resolution optical lapping and polishing, as well as high-precision grinding operations. SPEEDFAM 36 DPAW is engineered to provide reliable, repeatable operation, making it an ideal choice for high-end wafer processing. Its robust construction and superior process monitoring and control systems ensure high accuracy and high-quality surface finishes of the finished workpieces. In addition, this machine offers an optional fully closed loop tool to control and monitor the grinding/lapping and polishing process for even greater precision.