Used SPEEDFAM 36 DPAW #9372689 for sale

SPEEDFAM 36 DPAW is a fully automated wafer grinding, lapping, and polishing (DPAW) system designed specifically for the manufacture of today's ultra-thin wafers. This machine is used to grind and lap wafers with diameter up to 12 inches (305mm) and thickness down to 10 μm. It features an eight-piece chuck, dual grinding, and lapping motors, and digital roughing and finishing speed controls. 36 DPAW also features Active Process Control (APC), Adaptive Lapping, and Precision Control System technologies. All of these technologies are designed to automatically maintain and optimize process parameters, as well as to quickly respond to changes in product characteristics and process conditions. This ensures superior processing results, uniform wafers, and a cleaner workplace. SPEEDFAM 36 DPAW also includes a sample chamber that can handle up to 30 samples at a time. Samples are automatically fed to the chamber and moved to the machining positions for polishing. This machine also has a programmable logic controller (PLC) for automatic process control, a pre-vacuum chamber to ensure non-contamination during processing, an onboard liquid film polisher for edge-setting and other operations. The machine is constructed from high-grade stainless steel and is capable of withstanding high loads. The rotating components are mounted on precision ball bearings and all motors are housed in motor-cooled cabinets for maximum reliability and noise reduction. The machine is also equipped with a touchscreen control panel allowing for easy and quick setting of process parameters. 36 DPAW is an ultra-precision machine capable of delivering exceptional wafer quality. It is equipped with advanced process technologies designed to ensure the highest possible precision, repeatability, and quality. With its compact form-factor, the machine takes up little space and is easy to install and maintain.