Used SPEEDFAM 36 GPAW T0564 #293669498 for sale

SPEEDFAM 36 GPAW T0564 Wafer Grinding, Lapping & Polishing equipment is a versatile and high performance workcell designed to meet the processing needs of the Semiconductor Industry. The system consists of three independent stages of processing, all of which can be precisely adjusted and controlled to deliver exact and repeatable results. The first stage is the grinding process which is driven by a high speed linear motor, allowing for a wide range of abrasives and tools to be used with accurate speed and performance. The second stage is lapping which utilizes a unique, abrasive charged ring tooling built into the unit that quickly laps the surface of the substrate, flattening and polishing the surface to one micron tolerance. The third and final stage of processing is polishing, which uses a polishing head that is rapidly moved across the surface of the substrate, creating a uniform and repeatable finish. 36 GPAW T0564 machine also includes in-situ operation capability, allowing substrates to be processed and inspected without removal from the machine, resulting in reduced cost and production downtime. The tool also comes with a comprehensive control asset that provides a wide range of data processing and analysis capabilities, enabling the user to assess and analyze the quality of the surface finish achieved. SPEEDFAM 36 GPAW T0564 model is an extremely advanced workcell designed to provide the highest quality end results, making it ideal for use in modern semiconductor fabrication.