Used SPEEDFAM 36 GPAW-TD #9274951 for sale

SPEEDFAM 36 GPAW-TD Wafer Grinding, Lapping & Polishing Equipment is a dynamic and versatile system that is used to prepare semiconductor wafers for further processes in semiconductor technology. It utilizes a multi-purpose variable speed spindle in combination with oscillation and up and down flow capabilities to ensure the precise grinding, lapping, and polishing of a variety of wafer types. The unit delivers excellent surface finishes with very high repeatability and low cycle times. 36 GPAW-TD utilizes a free-standing base frame that houses the main unit, and can accommodate up to 5 process platens that are separated and are joined together via a center bar. The main unit features a direct motor drive, with an AC axis motor that is dynamically controlled and driven by a motor inverter variable speed drive. The oscillation and up/down flow of the platens is machine controlled, and is a unique feature of the tool. The spindle includes an integrated quill drive asset, which ensures an even distribution of force and prevents any misalignment of the spindle head. The model is programmable by a touch panel with a wide range of advanced functions, automatic control algorithms, product library, cycle monitoring, and real-time process optimization. The equipment has a maximum speed of 3600 rpm, with an indexed speed range of 1-3600 rpm, allowing for high precision grinding, lapping, and polishing of any wafer material. It also has a dynamic control system that can monitor and adjust the variables of the process quickly and accurately to ensure repeatable and reliable process conditions. SPEEDFAM 36 GPAW-TD Wafer Grinding, Lapping & Polishing Unit also comes with a range of advanced safety features, such as an emergency stop switch, a safety guard, and a digital control machine with built-in safety protocols. The tool is engineered and optimized to minimize both thermal degradation and maintenance requirements, ensuring maximum operational stability over time. Overall, 36 GPAW-TD is a versatile and dynamic asset that can be used to grind, polish and lap a variety of different semiconductor wafer materials with excellent precision. With its high speed, accuracy, and reliability capabilities, it is the ideal choice for the semiconductor industry.