Used SPEEDFAM 36 GPAW-TD #9275224 for sale

SPEEDFAM 36 GPAW-TD is a wafer grinding, lapping and polishing equipment designed to precisely process wafers for the manufacture of smart electronics. This state-of-the-art system uses advanced abrasive technology to produce ultra-fine flat surfaces with superior metallurgical fineness and consistency. The all-in-one automated unit is equipped with an array of diamond grinding, diamond lapping and diamond polishing tools that can be used to apply a range of highly specific surface finishes. The machine has an adjustable process speed and pressure, allowing for unparalleled precision and control over the polishing process. 36 GPAW-TD features a number of unique technologies, such as a high-precision combination of air/fluid polishing and grinding head technologies. This design increases productivity while reducing the risk of strain or damage to the wafer. The air/fluid polishing technology enables the tool to quickly and accurately polish a wide variety of wafer materials. It also features a multi-finger grab asset that can be adjusted to continually hold the wafer in the same position during processing. This ensures that every area of the wafer is accurately polished without any risk of damage. SPEEDFAM 36 GPAW-TD is capable of producing unmatched surface finish characteristics, with a MetPol Gritometer rating as low as 1.0 Ra. This model offers a higher degree of surface finish uniformity than any comparable grinding and polishing equipment on the market. In addition, the system has adjustable parameters, so that it can be configured to optimize the polishing process for a particular application. It can even be used in a wide range of applications, from memory chips to LEDs. In conclusion, 36 GPAW-TD is a powerful, feature-packed wafer grinding, lapping and polishing unit that offers unparalleled precision, efficiency and control over the polishing process. The combination of high precision, adjustable process speed and pressure, and adjustable parameters make it the ideal choice for high-volume, high-precision wafer processing.