Used SPEEDFAM 36 GPAW V0056 #293669479 for sale

SPEEDFAM 36 GPAW V0056 is an advanced wafer grinding, lapping & polishing equipment that is designed for high-precision and repeatable results. It utilizes advanced process control techniques to reliably achieve critical dimensional wafer reshaping tolerances while also providing superior surface finishing. The system is designed to enable fast and accurate surface preparation with minimal material removal for superior surface quality. 36 GPAW V0056 offers a range of innovative features that reduce setup time and improve surface finish consistency. It comes with a global sensor control unit which is designed to accurately monitor the temperature of the finishing tools, the grinding pressure on the wafer, and other vital parameters throughout the grinding process - optimizing throughput and process control. Additionally, it is equipped with direct drive multi-axis manipulators, rigid robotic base, designed for applications such as high-precision grinding with speed and accuracy. SPEEDFAM 36 GPAW V0056 includes a variable speed, multi-spindle drive machine that allows for precise and repeatable grinding and polishing operations with minimized cycle time. It is designed with a rigid bed base, splash guard, dry-vacuum tool and advanced dust collection capabilities to further enhance process control and extend the life of the wafer grinding tools. 36 GPAW V0056 comes with a user-friendly, PC-based controller which provides intuitive interface for programming and set-up, as well as real-time data displays and manual control options when needed. The asset also has measurement capability to enable optimization of the grinding process, as well as simultaneous abrasive polishing. To complement SPEEDFAM 36 GPAW V0056, the tools and consumables used in the grinding and polishing process are also designed to meet the exacting requirements of the model. The equipment is capable of utilizing abrasive, non-abrasive, lubricating, or polishing media as well as high-performance diamond lapping or polishing compounds for precision wafer grinding and lapping. The system also offers comprehensive training and on-site support options as well as flexible options for servicing and maintenance. Overall, 36 GPAW V0056 is a cutting-edge wafer grinding, lapping & polishing unit equipped with the necessary features and accessories which allow it to deliver outstanding results in terms of accuracy, registration, and surface finish quality. It enables significant improvement in throughput and tolerances without raising the cost of production, making it a valuable asset for any operation involving critical surface preparation of thin wafers.