Used SPEEDFAM 36 GPAW V0316 #293669478 for sale

SPEEDFAM 36 GPAW V0316 is a modern wafer grinding, lapping and polishing equipment designed to increase throughput and accuracy in the semiconductor manufacturing process. This machine is equipped with a 3-axis system for superior accuracy and efficiency, as well as a high-speed spindle and an integrated lapping/polishing table, enabling the user to handle large wafers up to 76.2mm in diameter. 36 GPAW V0316 boasts X, Y and Z speeds of 10 meters per minute and a high-speed spindle of up to 4300 rpm, enabling higher processing speeds and superior accuracy. The integrated lapping/polishing table also enables faster and more accurate grinding action and utilization of slurry, allowing higher productivity. The machine is also equipped with an ATC-30 specification Automatic Tool Changer with a 30-tool capacity, allowing the user to change tools quickly without manual intervention and reducing operator fatigue. Additionally, the unit employs an Industrial PC (IPC) for highly accurate CNC operation, with a 7-inch LCD touchscreen that allows the operator to check conditions and monitor settings at a glance. SPEEDFAM 36 GPAW V0316 also features comprehensive safety features, including control panels, emergency stops, and laser sensors for operator protection. The safety panels, combined with the motion control sensors and a high level of accuracy, ensure safe operation while still delivering fast processing. The machine also includes grinding dust collection baskets and a recirculation tool for improving accuracy and eliminating dust and other airborne particles from the working environment. In short, 36 GPAW V0316 is a powerful and efficient wafer grinding, lapping and polishing asset designed to increase throughput and accuracy in the semiconductor industry. With its 3-axis model, high-speed spindle, integrated lapping/polishing table, ATC-30 specification Automatic Tool Changer, Industrial PC, LCD touchscreen, and comprehensive safety features, this equipment provides fast and accurate grinding and polishing of large wafers, as well as reducing the risk of operator fatigue and creating a safe and healthy working environment.