Used SPEEDFAM 36 GPAW #293813770 for sale

SPEEDFAM 36 GPAW is a versatile wafer grinding, lapping and polishing equipment for a variety of industrial applications. This system is designed for precision and productivity in harsh, corrosive environments. SPEEDFAM 36GPAW unit features a high-speed grinding spindle, with a variable speed range from 0-2000 RPM, and automatic lubrication for improved performance. 36 GPAW machine utilizes a heavy duty grinding arm, capable of supporting up to 50kg of weight, for aggressive wafer grinding and polishing. The grinding arm features a ball-bearing swivel head which allows the grinding arm to move in a full-circle sweep for precise and consistent results. The grinding wheel is designed to reduce vibration, ensuring clean and uniform grinding results. This tool also features a powerful lapping spindle for maximum accuracy and speed. The lapping spindle offers a range of speed settings from 0-3000 RPM and is powered by a 15HP motor for more consistent results. The patented Floating Head technology enables the spindle to stay in constant contact with the wafer throughout the lapping process, providing accurate and repeatable results. The asset also includes a polishing chamber for polishing the surface of the wafer to a mirror finish. The polishing chamber is a vacuumized pressure chamber that utilizes two spindles for a more uniform polish. The chamber also features a powerful dust collection model to reduce debris and contamination. 36GPAW equipment can be purchased as either a factory built, complete system or as individual components, for tailoring the unit to the specific needs of the customer's operations. SPEEDFAM 36 GPAW machine also boasts a user-friendly interface and software package, making it easier to track and monitor the grinding and polishing processes. SPEEDFAM 36GPAW tool is a versatile and reliable asset for wafer grinding, lapping and polishing. This model is designed to provide precise and repeatable results, while delivering quick and efficient processing. The powerful lapping and polishing spindles, the user-friendly interface, and the sturdy grinding arm combine to make 36 GPAW a reliable and efficient equipment for wafer grinding, lapping and polishing.