Used SPEEDFAM 36 GPAW #293820364 for sale

SPEEDFAM 36 GPAW is a wafer grinding, lapping and polishing equipment used to produce semiconductor wafers and hard disks with high precision and surface finishes. This system provides many features to optimize production and maximize performance. The unit includes a 36-inch grinding and lapping wheel which can accommodate a wide range of wafer size from 25mm to 300mm. This wheel has a variable speed from 30 to 120 RPM to ensure higher throughput and accuracy on different sized wafer products. The wheel is equipped with a water recirculation machine for increased efficiency. The grinding, lapping and polishing tool utilizes a robotic arm for automatic loading of wafers with an adjustable loading height for a variety of wafers sizes. The robotic arm also allows for precise positioning of wafers for optimum process control. SPEEDFAM 36GPAW maintains a consistent high degree of grinding, lapping and polishing accuracy with an accuracy of +/- 4 microns. The asset is equipped with a touch-screen operator control panel that displays all process parameters such as wheel speed, cycle time, grinding/lapping pressure, and material removal rates. This allows for easy adjustments and quick operator response in case of any uncertainty or changes in the process. Safety features are also included in 36 GPAW, such as an emergency stop button and automatic shut-off if the wheel is overloaded. 36GPAW offers peace of mind for any wafer grinding, lapping and polishing operators, as it offers high quality and precision results, as well as ease to use processes with minimal labor and maximum process control. With its advanced features, SPEEDFAM 36 GPAW is an ideal choice for any production process that requires high precision and accuracy.