Used SPEEDFAM 36 GPAW #9266990 for sale

SPEEDFAM 36 GPAW is a cutting-edge equipment designed for the grinding, lapping, and polishing of semiconductor and other wafers. The system utilizes advanced computer-controlled technology to control grinding wheel spindle speed, position, and feed rate for precision results. The unit has an integrated material handling machine that can be used to operate an automated grinder, lapper, and polisher. The heart of this tool is a powerful microprocessor-controlled numerical control (NC) asset, which allows for very precise operation. The NC model is designed to provide a wide range of motion within a small volume, enabling efficient wafer manipulation and processing. The equipment also integrates a closed-loop, servo-controlled spindle speed control system that provides quick setup and operation. SPEEDFAM 36GPAW is capable of grinding, lapping, and polishing wafers with sizes ranging from 2" to 6". The unit is designed to accommodate a variety of grinding wheels and fixtures. It comes with a built-in grinding wheel dressing mode and has an integrated safety switch for emergency stop. The machine also features a coolant tool designed to improve the cutting efficiency and eliminate coolant misting. The asset is also equipped with a mist suppressor model that allows for improved working environment and efficient dust and mist collection. Finally, the equipment also has an integrated gas suspension system that minimizes grinding wheel sticking and optimizes part grinding and finish. Additionally, the unit can be connected to a network for easy remote monitoring and control. In conclusion, 36 GPAW is an advanced wafer grinding, lapping, and polishing machine that incorporates state-of-the-art components and features an integrated material handling tool and a powerful microprocessor-controlled numerical control (NC) asset. The model is designed to meet the demands and requirements of a wide range of semiconductor and other wafer grinding, lapping, and polishing applications.