Used SPEEDFAM 36 GPAW #9268565 for sale

SPEEDFAM 36 GPAW (Wafer Grinding, Lapping & Polishing Equipment) is a state-of-the-art machine designed to provide high-precision wafer grinding, lapping and polishing operations with extremely tight process control and repeatability. This highly configurable, systems-based machine can be set up and operated to meet individual application requirements. Each system is designed to be highly flexible and easily tailored to each customer's unique specifications. SPEEDFAM 36GPAW offers industry-leading utilization rates and unprecedented automation, making it the ideal wafer processing unit for higher-volume, time-sensitive manufacturing operations. The machine integrates wafer grinding, lapping and polishing capabilities within a single machine, and can be configured with up to three process heads for concurrent processing of different parts. Built-in, optimized software allows for best-in-class user-friendly operating functionality and comprehensive process control. The user interface provides detailed real-time process information and alerts. 36 GPAW is equipped with high-precision air bearings that support linear and rotary motions with minimal friction to reduce thermal effects. The tool includes high-performance, digitally-controlled drive motors that provide speed control to optimize the grinding, lapping and polishing speeds based on part requirements. It also features high-efficacy grinding and polishing motors enabling low consumption levels while achieving superior results. 36GPAW has a robust modular platform and utilizes advanced materials to ensure long service life. The asset also features a safe work environment via interlocked doors and doors switches as well as optical power lockouts. Additionally, advanced safety features include emergency stop buttons, light curtains and error reporting functions for improved process performance and regulatory compliance. SPEEDFAM 36 GPAW is compatible with a wide variety of components, allowing for quick set-up and programming of the model. The equipment accepts wafer sizes from 2.5-inch to 8-inch in diameter and is built to last with well-established design principles, high quality parts and advanced coatings. Additionally, the system supports various types of robotic handling systems for automation. SPEEDFAM 36GPAW is the ideal unit for high-volume, time-sensitive manufacturers who require maximum precision and repeatability. The highly automated machine offers industry-leading utilization rates and unprecedented user-friendly operating functionality. Its streamlined configuration allows for fast set-up and optimization in order to reduce setup time and cost. The tool's advanced safety features, wide-ranging capability and excellent technical support make it the perfect solution for all your wafer processing needs.