Used SPEEDFAM 36 GPAW #9268566 for sale

SPEEDFAM 36 GPAW is a wafer grinding, lapping, and polishing system that is designed to yield superior results in the preparation of wafers for both research and production purposes. This machine is equipped with the latest in high-tech precision grinding technology, using the most powerful systems in the industry, to ensure a smooth, flat, and uniform surface on any type of wafer. It is capable of producing results with micron-level accuracy and uniformity. SPEEDFAM 36GPAW offers three primary processes: wafer grinding, lapping, and polishing. With the grinding processes, particles are removed from the wafer surface by a combination of mechanical and chemical forces. The lapping process further removes any remaining particles and produces a uniform and smooth surface. Lastly, the polishing process uses abrasive particles to obtain a highly polished finish. 36 GPAW uses a flat platen with adjustable speeds and platen sizes to accommodate different types of wafers. The flat platen has a series of V-grooves that allow for the secure attachment of the wafer. Adjustable settings also allow for fast and consistent grinding and lapping according to the desired results. Various accessories can be used with 36GPAW. These include polishing compounds, abrasive papers, and diamond-embedded carriers. The adjustable settings allow for precise control over the amount of force applied for optimal wafer preparation. This ensures a level of accuracy up to 10nm and significantly improves the efficiency and quality of the polishing process. SPEEDFAM 36 GPAW is a highly reliable machine, capable of operating continuously with minimum downtimes and maintenance. This system is suitable for process control and offers real-time data analysis. Additionally, the automated process ensures consistent and repeatable preparation time after time. SPEEDFAM 36GPAW system has been designed to meet the highest and most stringent of standards. It is certified and compliant with ISO 14001: 2015 regulations and CE marking for European regulations. Manufacturers around the world have chosen this machinery as a dependable source for superior wafer preparation.