Used SPEEDFAM 36 GPAW #9268569 for sale

SPEEDFAM 36 GPAW is a wafer grinding, lapping and polishing equipment designed for precision and repeatability. It allows the grinding and polishing of surfaces to tight tolerances in the micron range with high accuracy. This system is tailored for semiconductor processing and is used for the fabrication of MEMS, sensors, and other micro-electronic components. SPEEDFAM 36GPAW is designed to withstand intense vibration and minimize lapping and polishing imperfections using a robust direct drive motor and powerful abrasive wheels. It employs an automatic, inclinable spindle with a three-axis control unit that ensures accurate pressure and speed control. The machine utilizes a constant pressure and position control feature which helps in producing reproducible surface properties. At the heart of 36 GPAW is a unique grinding and polishing tool with a modular design. It comes with integrated pressure and temperature sensing as well as automated sampling speeds, which can easily be adjusted while in operation. With its automated features, it is possible to adjust the depth of grinding or polishing as well as the profile of the material over large areas. The asset is capable of grinding, lapping, and polishing with diamond, E-Wafer, polishing abrasive, and other materials. It can process both flat surfaces and grooves in a variety of materials including metals, plastics, ceramics, and glass. It also offers multiple configurations with its configurable vision model, ergonomic panel, and removable fixture. 36GPAW is a versatile solution for grinding, lapping, and polishing at multiple point of process. Its advanced technology and intuitive user interface maximize accuracy and repeatability. With its robust design, it is ideal for high-speed semiconductor fabrication processes.