Used SPEEDFAM 36 GPAW #9278867 for sale

SPEEDFAM 36 GPAW is a precision wafer grinding, lapping and polishing equipment designed by SPEEDFAM, a leading provider of high-performance disc finishing machines for wafer production. The machine is a versatile production system capable of high-precision and high-volume production of semiconductor and other wafer-shaped components. The unit contains a series of rotating discs known as "Lappers" that grind and polish the surface of the wafer to an accuracy of <1 nanometer. Each Lapper operates independently, with a full range of drive and control parameters to tune the grinding, lapping and polishing process to a specific application. The machine can process wafers up to 8 inches in diameter and can be configured to run at a variety of speeds. SPEEDFAM 36GPAW is designed to produce the highest quality and most consistent wafer surfaces possible, with an increase in surface integrity, flatness, and thickness uniformity over other systems. The tool utilizes a unique combination of power, accuracy and speed to produce superior results. The machine includes a rugged, servo-controlled SPM for controlling the grinding angles and process parameters for the highest quality product. The main asset control is a digital PC-based model that serves as the user interface and manager of all machine functions, including the software, hardware and communications. The equipment software is easy to use and provides a graphical interface and recipe database which allows for the efficient setup and automation of wafer grinding, lapping and polishing jobs. 36 GPAW is a reliable and robust system that is widely used in the semiconductor and other industries where high-precision grinding, lapping and polishing are required. It offers a number of customizable features and produces precise wafer components with the highest quality.