Used SPEEDFAM 36 MS #9258020 for sale

SPEEDFAM 36 MS Wafer Grinding, Lapping, & Polishing Equipment is a fully automated system designed to achieve optimum performance and accuracy in wafer grinding, lapping, and polishing operations. This unit is designed to grind and lap two wafers up to 12" in diameter with excellent surface finish quality. The machine uses a high-precision, three-axis motor drive and advanced controlling software to ensure precise, repeatable part positioning and grinding. The grinding heads on SPEEDFAM 36MS are robust and precisely machined, and they feature matched pneumatic wheel speeds that can be adjusted quickly and easily for different parts. The tool also features a precision lapping and polishing head that has been specifically designed to achieve the highest levels of accuracy, repeatability, and surface finish quality. The asset is fitted with a vacuum chuck to ensure part stability and secure fixing during processing. Finally, the model can be fine-tuned for specific processes and applications by utilizing an array of software options. 36 MS is capable of obtaining a wide range of part accuracy and surface finish specifications. It offers an extensive protocol library with easy-to-modify parameters, which helps in setting up the process for specific applications. The operating equipment is highly flexible with process control elements such as grinding speeds, feed rates, wheel wear compensation, and pressure control, all of which can also be adjusted to suit the application. This system is also equipped with an intelligent feedback module that monitors the process parameters to ensure that optimal grinding, lapping, and polishing results are achieved consistently. 36MS also features a range of safety features that can be customized to meet the needs of a particular application. The unit includes an emergency stop button for manual control and an array of digital safety sensors to protect the machine from any potential danger. It is also equipped with a self-cleaning tool to ensure that all debris or materials used in the lapping/polishing process are removed after completion. Furthermore, the asset features an interactive LCD display with a graphical interface for intuitive operation. In summary, SPEEDFAM 36 MS is a superior quality wafer grinding, lapping, and polishing model that is designed to produce an extremely high level of accuracy and superior surface finish quality. It features a powerful three-axis motor drive and precise controls, as well as a range of safety features to ensure operator safety. Its interactive LCD display and graphical interface make it very easy to operate.