Used SPEEDFAM 36 SPAW #9280812 for sale

SPEEDFAM 36 SPAW (Surface Process Advanced Wafer) is a wafer grinding, lapping & polishing equipment that is designed to help achieve fine surface finishes on semiconductor wafers. The system features a unique combination of features that make it highly efficient, automated and cost effective. The polishing unit features a 50mm diamond grinding wheel, which allows for quick and precise grinding, lapping and polishing of wafers. This wheel is powered by a 12-24 hp motor and is capable of grinding wafers up to 8" in size. The grinding wheel is also equipped with a "soft-stops" feature that enables it to reduce micro-scratches to a minimum. SPEEDFAM 36SPAW also features a precision-controlled polishing pad head. This feature ensures consistent and uniform surface finish on each wafer, even when processing large batches. Its superior motion control enables the machine to handle up to 20 wafers simultaneously. 36 SPAW is designed for quick and easy setup, operation and maintenance. It has an intuitive Human Machine Interface (HMI) that allows for easy configuration of the tool for specific applications. Furthermore, its high-efficiency ventilation asset keeps dust and other contaminants to a minimum. The model also includes an advanced safety measures such as Automatic Speed Control (ASC) and Validation Equipment (VSP). With the ASC system, the unit reduces its speed to a safe level as soon as grinding operations start. This ensures maximum safety while the grinding takes place. With the VSP machine, the tool is capable of validating the grinding and polishing operations performed in order to guarantee consistency and accuracy. 36SPAW is an efficient, automated and cost-effective wafer grinding, lapping and polishing asset that is designed to give superior results for a variety of applications. It is ideal for use in the semiconductor industry for sharpening, lapping and polishing applications.