Used SPEEDFAM 36B #9281363 for sale

SPEEDFAM 36B is a high-performance wafer grinding, lapping and polishing equipment specifically designed to increase throughput and reduce cycle times. This two sided grinding/polishing system utilizes a unique design of programmable Abralon wheels and diamond films to ensure accuracy and consistency. 36B platform is equipped with a high-performance motor and drive unit that enable quick acceleration and deceleration of the grinding and polishing operations. This machine is capable of achieving extreme precision and surface finish levels on wafer substrates. SPEEDFAM 36B offers a variety of lapping and polishing capabilities to meet the demands of different applications. The unit is equipped with two 12" programmable Abralon wheels that can be used for grinding, lapping and polishing operations. The Abralon wheels are versatile and designed to provide consistent, repeatable results with each application. The polishing platform also features an integrated diamond film application that provides quick and accurate polishing operations. Additionally, the tool is capable of processing all types of wafer substrates including silicon, gallium arsenide, and glass. 36B features an easy-to-operate control asset that provides automated procedural control over all wafer grinding and polishing operations. The unit also features an intuitive user interface that allows operators to quickly and accurately set process parameters such as process speed, material selection, and grinding pressure. This model ensures that all operations are completed quickly and accurately, and that product specifications are met every time. SPEEDFAM 36B is equipped with a number of safety features to prevent accidents and minimize operator risk. These include safety guards, emergency shutdown switches, and an adjustable vacuum equipment. These safeguards ensure that production continues uninterrupted and that hazardous particles and debris are kept out of the system. Additionally, the unit is equipped with integrated optics that provide real-time monitoring of the progress of the grinding and polishing operations. 36B is a reliable and versatile wafer grinding, lapping and polishing unit that is ideal for a variety of applications. The machine is designed to process all types of wafer substrates and materials, and its user-friendly control tool and safety features ensure that the highest levels of quality are achieved with every operation. SPEEDFAM 36B is an ideal asset for any manufacturing operation that requires precision grinding and polishing.