Used SPEEDFAM 40B #9410062 for sale

SPEEDFAM 40B is a versatile, compact, high-precision wafer grinding, lapping, and polishing equipment designed for precision grinding and polishing of Silicon or other semiconductor materials. It is capable of grinding through many different wafer sizes as well as handling multiple wafer materials. 40B is an automated, computer-controlled system. The unit features a multi-axis table that is capable of precise, repeatable motion along three axes (Y, Z, and rotation) to position the wafer within the grinding and polishing area. This ensures the precision placement of the wafer to the grinding and lapping tools. The machine also incorporates an in-line edge epi-polishing capability, providing a precise, uniform finish. SPEEDFAM 40B utilizes a unique 'open-frame' design allows operators to easily access the grinding, lapping, and polishing with wafer loading and unloading facilitated by the 'dual-process platform' approach. This allows operators to position two processes simultaneously, thus allowing for a faster production process. 40B utilizes the latest in non-contact sensing technologies to measure the thickness and flatness of the wafers during the grinding, lapping, and polishing process. This feedback is used to diligently adjust the position of the grinding and polishing pads to ensure perfect results. SPEEDFAM 40B tool is designed to achieve superior accuracy with each pass thanks to a robust, precision-ground spindle, special surface stabilizers, and an optimized internal grinding asset. It is equipped with a wide range of grinding, lapping, and polishing pads, and these can all be controlled individually or with a group of pads. 40B has a number of safety features, including an acoustic and optical warning model, adjustable-speed motor, grinding-wheel guard, and an electronic key and lock. This ensures that operators are safe while also maintaining consistent performance of the equipment. SPEEDFAM 40B is a powerful, user-friendly, and productive system that is designed to provide superior surface and thickness accuracy. The unit is capable of precision grinding, lapping, and polishing of a wide range of materials, enabling quick and efficient production for higher quality results.