Used SPEEDFAM 48 BAW #9226535 for sale

SPEEDFAM 48 BAW is a comprehensive grinding, lapping, and polishing solution designed to quickly and easily prepare wafer surfaces for their subsequent applications. The equipment is designed to be highly precise, capable of removing even a few atoms of material from a sample wafer in order to achieve the desired surface finish. The system works by rotating a sample wafer at high speeds between two plates of diamond plated lapping tools, with one tool grinding the top of the wafer and the other tool grinding the bottom. This causes abrasive particles to be drawn between the two plates by two vacuum systems mounted at both sides of the plates, with the particles being drawn through a screen at the bottom of the plates. By continuously adjusting the speed and pressure of the two plates, the material is removed from the wafer with optimal uniformity. 48 BAW is capable of lapping and polishing both single and double-sided wafers. The wafer is held by a special vacuum chuck which allows it to be securely locked in place during the grinding and lapping process. The unit offers a range of physical parameters to ensure the best possible performance; it can grind and lap from 1 to 5 micron surfaces with a high degree of flatness and surface roughness. The machine operates via an intuitive color touch-screen interface which displays all relevant operational data and allows users to set up, monitor, and control the grinding and lapping process. The tool's simple-to-use controls and settings allow for high levels of repeatability, precision, and accuracy. SPEEDFAM 48 BAW grinding, lapping, and polishing asset is therefore an essential solution designed to help achieve the most accurate surface preparation of wafers on the market today. With its high-precision machinery and easy-to-use controls, the model is ideal for all types of wafer grinding, lapping, and polishing applications.