Used SPEEDFAM 48 BAW #9250728 for sale

SPEEDFAM 48 BAW is a multi-functional wafer grinding, lapping & polishing equipment designed to produce high quality wafers with maximum throughput. The system uses a dual-head grinder-lapper-polisher setup to provide a complete solution for achieving high-precision wafers. It is capable of quickly processing a wide variety of wafer sizes ranging from as small as 125 μm to as large as 500 mm. 48 BAW is a flexible, easy-to-use unit that allows for a variety of process settings. The grinder-lapper-polisher setup provides a comprehensive range of grinding and polishing steps along with a variety of abrasive sizes, allowing for a variety of surface finishes. The machine also offers a variety of options for power requirements, allowing for flexibility in production scheduling. SPEEDFAM 48 BAW is built with precision and accuracy in mind. Its automated tool features a modular design that allows for easy setup and maintenance. It utilizes precision line scanning optics to measure wafer flatness and z-axis gradients, allowing for highly precise measurement and control of the grinding process. The asset also features a variety of safety features, including automatic shutdown when it detects that the low-tuck condition has been exceeded. 48 BAW's automated model is built to meet all requirements for particle size and surface finish. The equipment is also equipped with a comprehensive process monitoring system that keeps track of process parameters in real-time, allowing complete traceability of the process. Overall, SPEEDFAM 48 BAW is a state-of-the-art unit designed to provide high precision wafer grinding, lapping, and polishing. Its easy-to-use, modular design offers a range of adjustable settings for process control, power requirements, and safety features. Its automated machine ensures a strict adherence to quality control and traceability of the wafer production process.