Used SPEEDFAM 48 BW #9254521 for sale

SPEEDFAM 48 BW is a high performance multi-purpose wafer grinding, lapping, and polishing equipment designed to precisely and efficiently produce high quality flat, mirror-like surfaces on semiconductor wafers. The system uses a patented contact technology to ensure a smooth and uniform grinding process and features a wide range of adjustable options to meet the particular requirements of the application. The unit includes a 48 inch diameter turntable for wafer mounting and a high-powered spindle motor with speeds up to 10,000 RPM for the rapid grinding and polishing operations. The grinding process is adjustable for a range of applications, from delicate polishing to aggressive grinding, and the machine features a vertical spindle displacement to ensure efficient operation with minimal breakage. The machine also includes a wide range of lapping options, from very fine to coarse, in order to produce optimal results for the application. The lapping process is adjustable for a range of applications as well, from the production of high quality semiconductor wafers to the lapping of abrasive materials. The tool also includes an integrated polishing process, which offers adjustable speed and pressure settings to ensure the highest quality polished surface. Additionally, the machine features a fully automated cleaning and maintenance routine, offering an efficient solution to long-term production needs. Overall, 48 BW is a high performance wafer grinding, lapping, and polishing asset designed to accurately and efficiently produce high quality finished products.